Current Members
Dinh-Phuc Tran
Post doctor
Fu-Chian Chen Yi-Quan Lin Yu-Wen Hung
Ph. D Student Ph. D Student Ph. D Student
Cu foil rotary ECD Cu RDL electromigration Cu foil rotary ECD
Mechanical properties Cold rolling Cu foil Mechanical properties
Cu/Pd Co-ECD Nanotwinned Cu RDL Cu RDL electromigration
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Huai-En Lin Ph. D Student In-situ heating AFM Cu/SiO2 hybrid bonding Nanotwinned Cu AGG |
Pin-Syuan He Ph. D Student Cu/PI hyrbrid bonding Cu/SiCN hybrid bonding CMP optimization |
Shih-Chi Yang Ph. D Student Cu joints electromigration Cu/SiO2 hybrid bonding Reliability tests
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Kang-Ping Lee Ph. D Student Cu foil rotary ECD Mechanical properties Cu/Ni Co-ECD |
Jian-Yuan Huang Ph. D Student Nanocrystalline Cu Cu-Cu bonding Electroplating |
Chen-Ning Li Ph. D Student Nanocrystalline Cu Cu-Cu bonding Cu damscene process
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Yi-Chen Chung Ph. D Student SiCN-SiCN bonding CMP optimization Nanotwinned Cu ECD
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Ankush Kumar Ph. D Student Nanocrystalline Cu Cu-Cu bonding Electroplating |
Pin-Lin Chen Ph. D Student Cu/SiO2 hybrid bonding In-situ heating AFM Electroplating |
Chih-Chi Tsai Ph. D Student Cu RDL electromigration
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Ming-Han Lu Ph. D Student Cu-Cu bonding |
Yun-Hsuan Chen Ph. D Student Cu/SiCN hybrid bonding |
Ciao-Yun Luo Master student Cu/CNT electroplating |
Chien-Yu Liu Master student SiCN-SiCN bonding
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Hsin-Yu Tsai Master student Cu joints electromigration |
Po-Hung Lai Master student Cu-Cu bonding |
Te-Hao Chao Master student Damascene via ECD |
Ming-Chieh Chen Master student Cu-Cu bonding
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Ke-Wei Hsieh Master student Cu-Cu bonding |
Po-Jui Su Master student Cu foil rotary ECD |
陳鼎錡 Master student Research
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Chih-Hsin Tu Master student SiCN-SiCN bonding
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卓靖 Master student Research
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Kai-Hsin Lin Master student Research
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