Die-level bonding machine (208)

Mechanical polishing machine (605)

Chemical mechanical planarization machine (754)

Tensile test machine (754)

Micro-indenter (754)

8″ wafer electroplating machine (605)

Dicing 8″ wafer machine (605)

4 point probe system (754)

Rotary electroplating machine (605)

Plasma treatment machine (208)

Electromigration testing system (605)

Shear test machine (754)