Conference Publications

► 2024~ (12)
  1. “Low-Temperature Cu-Cu bonding Using Nanocrystalline Grains” C. N. Li, et al. ICEP (2024)
  2. “Characterization of Surface Activation on Nanotwinned Copper and SiCN by using Ar and N2 Plasma” R. J. Lee, et al. ICEP (2024)
  3. “Surface Modification by Wet Treatment for Lowtemperature Cu/SiO2 Hybrid Bonding” Y. A. Chen, et al. ICEP (2024)
  4. “Effects of the Nanoporous Cu Interlayer on the Bonding Area and Strength for Applications in Packaging of High Power Devices” W. H. Lu, et al. ICEP (2024)
  5. “The enhancement in the reliability of nanotwinned Cu redistribution lines passivated with immersion Sn and Ag” Y. W. Hung, et al. ICEP (2024)
  6. “The effect of electromigration and stress migration on NT-Cu RDLs passivated with titanium dioxide” Y. Q. Lin, et al. ICEP (2024)
  7. “Effect of (111) Surface Ratio on the Bonding Quality of Cu-Cu Joints” J. Y. Huang, et al. ECTC (2024)
  8. “Observation of Thermal Expansion Behavior of Nanotwinned-Cu/SiO2 & Regular-Cu/SiO2 Hybrid Structure via In-Situ Heating AFM” H. E. Lin, et al, ECTC (2024)
  9. “Low-Temperature Cu-Cu Bonding Using< 111>-oriented and Nanocrystalline Hybrid Surface Grains” C. N. Li, et al. ECTC (2024)
  10. “Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding” Y. A. Chen, et al. ECTC (2024)
  11. “Electromigration Failure Mechanisms of Cu-Cu Joints at Low Stressing Temperatures” S. C. Yang, et al. ECTC (2024)
  12. “Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly< 111>-Oriented Nanotwinned Cu” P. S. He, et al. ECTC (2024)
► 2023~ (6)
  1. “Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics” G. Y. Shen, et al. ICEP (2023)
  2. “Fine-pitch <111>-oriented NT-Cu/SiO2 hybrid joints with high thermal fatigue resistance and low contact resistivity” J. J. Ong, et al. ICEP (2023)
  3. “Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2 Hybrid Bonding” S. C. Yang, et al. ICEP (2023)
  4. “High Temperature Storage of Cu-Cu Joints Fabricated by Highly (111)-oriented Nanotwinned Cu” S. C. Yang, et al. ECTC (2023)
  5. “Surface modification on hydrophilicity enhancement using NH4OH, NaOH, and KOH on fine-pitch low-temperature Cu/SiO2 Hybrid Bonding” J. J. Ong, et al. ECTC (2023)
  6. “Low Contact Resistance and Low Temperature Hybrid Bonding with Polyimide and Highly< 111>-oriented Nanotwinned Cu” P. S. He, et al. IMPACT (2023)
► 2022~ (3)
  1. “Modeling of Cu-Cu thermal compression bonding” K. C. Shie, et al ECTC (2022)
  2. “Fabrication and reliability analysis of quasi-single crystalline Cu joints using highly< 111>-oriented nanotwinned Cu” J. J. Ong, et al. ECTC (2022)
  3. “Low Thermal Budget Cu/SiO2 Hybrid Bonding Using Highly< 111>-oriented Nano-twinned Cu with Low Contact Resistivity and High Bonding Strength” J. J. Ong, et al. IMPACT (2022)
► 2021~ (6)
  1. “Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding” K. C. Shie, et al. ECTC (2021)
  2. “Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget” K. C. Shie, et al. ECTC (2021)
  3. “Non-destructive Observation of Void Formation Due to Electromigration in Solder Microbump by 3D Xray” K. C. Shie, et al. ECTC (2021)
  4. “Two-step fabrication process for die-to-die and die-to-wafer Cu-Cu bonds” J. J. Ong, et al. ECTC (2021)
  5. “Void ripening in Cu-Cu bonds” H. C. Liu, et al. LTB-3D (2021)
  6. “Microstructure analysis and tensile strength of low temperature Cu bonds using highly-< 111> Cu” J. J. Ong, et al. LTB-3D (2021)
► 2020~ (9)
► 2009~ (8)
  1. “Optima design of contact opening for relieving current crowding effect in flip-chip solder joints” S. W. Liang, et al. ESIME (2009)
  2. “In-situ observation of the failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints” H. Y. Chen, et al, ECTC (2009)
  3. “Effects of electromigration on grain rotation behavior of SnAg solders” H. W. Lin, et al. IMPACT (2009)
  4. “Investigation of joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration” H. Y. Hsiao, et al. IMPACT (2009)
  5. “Effect of passivation opening design on electromigration reliability issue in flip-chip solder joints” T. Y. Chen, et al. IMPACT (2009)
  6. “Electrical characterization of fine-pitch compliant bumps” C. K. Lin, et al. IMPACT (2009)
  7. “Optimal design of passivation/UBM openings for reducing current crowding effect under electromigration of flip-chip solder joint” Y. W. Chang, et al. EPTC (2009)
  8. “Shape Effect of Passivation Opening on the Electric Behavior in Flip-chip SnAg Solder Joints under Electromigration” H. Y. Peng, et al. EPTC (2009)
► 2008~ (5)
  1. “Kinetic study of eutectic Sn-3.5Ag and Electroplated Ni metallization in flip-chip solder joints” H. Y. Chen, et al. EMAP (2008)
  2. “Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates” C. K. Lin, et al. EMAP (2008)
  3. “Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy” H. Y. Hsiao, et al. EMAP (2008)
  4. “Enhancing Sn-Ag Solder Joints Electromigration Lifetime via the Under-Bump-Metallization Structure Design” H. Y. Chen, et al. EPTC (2008)
  5. “Effect of Passivation Opening on Electromigration in Eutectic SnPb Solder Joints” F. J. Shen, et al. EPTC (2008)
► 2007~ (2)
  1. “Study of Electromigration of flip‐chip solder joints using Kelvin probes” Y. W. Chang, et al. AIP proceedings (2007)
  2. “Theoretical Stress Calculation and Experimental Results of “NCF-type Compliant-Bumped COG”” M. Y. Chen, et al. EPTC (2007)
► 2006~ (2)
  1. “Electromigration in Flip-chip solder joints” C. Chen, ICSICT (2006)
  2. “Electromigration in Pb-free solder bumps with Cu column as flip chip joints” J. W. Nah, et al. ECTC (2006)
► 2005~ (1)
  1. “3-D simulation on current density distribution in flip-chip solder joints with thick Cu UBM under current stressing” S. W. Liang, et al. ECTC (2005)