► 2024~ (14)

1. “High-strength and high-conductivity nanotwinned Cu lightly doped with Ni” Lee, Kang-Ping, et al. Materials Science & Engineering A 891 (2024) 145990
2. “Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints” Tran, Dinh-Phuc, et al. Materials 2024, 17(9), 2004
3.  “Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films” Lin, Huai-En, et al. Materials Characterization 211 (2024) 113891
4.  “Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding” Lin, Huai-En, et al. Applied Surface Science 672 (2024) 160784
5.  “Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition” Lee, Kang-Ping, et al. Electrochimica Acta 500 (2024) 144769
6.  “In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures” Lin, Huai-En, et al. Applied Surface Science 662 (2024) 160103
7.  “Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding” He, Pin-Syuan, et al. Journal of Electroanalytical Chemistry 969 (2024) 118544
8.  “Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints” Yang, Shih-Chi, et al. Journal of Materials Research and Technology 32 (2024) 3490-3499
9.  “Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology” Yao, Yifan, et al. Scripta Materialia 250 (2024) 116175
10.   “Effect of heterogeneous microstructures on mechanical properties of thin gradient nanotwinned copper foils” Hung, Yu-Wen, et al. Surface & Coatings Technology 494 (2024) 131381
11.  “Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films” Chen, Kuan-Ju, et al. Journal of Materials Research and Technology 33 (2024) 2530–2537
12.  “Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect” Yang, Shih-Chi, et al. Journal of Materials Research and Technology 33 (2024) 4522–4532
13.  “Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests” Hung, Yu-Wen, et al. Materials (2024), 17, 5458.
14.  “Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation” Lee, Rou-Jun, et al. Applied Surface Science 684 (2025) 161832
15. “Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/SnAg/Ni/Cu microbumps” Yang, Shih-Chi, et al. Journal of Alloys and Compounds 1021(2025) 17961

► 2023~ (13)

1.  “In Situ Study of Twin Boundary Stability in Nanotwinned Copper Pillars under Different Strain Rates.”  Chang, Shou-Yi, et al. Nanomaterials 13.1 (2023): 190.
2. “Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing.” Lai, Jyun-Yu, et al. Nanomaterials 13.4 (2023): 709.
3. “Periodic reverse electrodeposition of (1 1 1)-oriented nanotwinned Cu in small damascene SiO2 vias.”  Yang, Shih-Chi, et al. Journal of Electroanalytical Chemistry 935 (2023): 117328.
4.    “Highly Selective Electrochemical Reduction of CO2 into Methane on Nanotwinned Cu.” Cai, Jin, et al. Journal of the American Chemical Society 145.16 (2023): 9136-9143.
5.  “High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation.” He, Pin-Syuan, et al. Nanomaterials 13.9 (2023): 1575.
6.  “To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints.” Huang, Yan-Rong, et al.  Journal of Materials Research and Technology 24 (2023): 7910-7924.
7. “Influence of additives induced microstructural parameters on mechanical behavior of (111)-oriented nanotwinned microcrystalline copper.” Singh, Chetan, et al.  Materials Science and Engineering: A (2023): 145150.
8.  “Potassium Hydroxide Surface Modification for Low Temperature Cu/SiO2 Hybrid Bonding.” Ong, Jia-Juen, et al. Surfaces and Interfaces (2023): 103076.
9. “Low Temperature Cu/SiO2 Hybrid Bonding via< 111>-Oriented Nanotwinned Cu with Ar Plasma Surface Modification.” Yu, Min-Hsun, et al. Applied Surface Science (2023): 157854.
10. “Recrystallization and Grain Growth in Cu-Cu Joints under
    Electromigration at Low Temperatures.” Yang, Shih-Chi, et al. Materials (2023), 16, 5822
11. “Measurement of Thermal Stress by X-ray Nano-Diffraction
    in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2
    Hybrid Joints.” Hsu, Wei-You, et al. Nanomaterials (2023), 13, 2448
12. “Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu–Cu Bonding.” Tseng, Hsiang-Hou et al.Crystal Growth & Design 2023 23 (8), 5519-5527
13. “High toughness of nanotwinned copper lines after annealing.” Hsu, Wei-You et al.Materials Science and Engineering: A, Volume 887, 2023, 145749

▲Back to top▲

► 2022~ (16)

1. “Nanotwin orientation on history-dependent stress decay in Cu nanopillar under constant strain.” Shen, Yu-An, et al. Nanotechnology 33.15 (2022): 155708.
2. “Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.” Lin, Po-Fan, et al. Materials 15.3 (2022): 937.
3. “Mechanical Strengthening of Nanotwinned Cu Films with Ag Solid Solution.” Lee, Kang-Ping, et al. Materials Letters (2022): 131775.
4. “Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces.” Ong, Jia-Juen, et al. Materials 15.5 (2022): 1888.
5. “Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste.” Kuo, Yu-Hao, et al. Journal of Materials Research and Technology 18 (2022): 859-871.
6. “Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils.” Fang, Chuan-Yu, et al. Journal of The Electrochemical Society (2022).
7. “Artificial intelligence deep learning for 3D IC reliability prediction.” Hsu, Po-Ning, et al. Scientific Reports 12.1 (2022): 1-7.
8. “Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions.” Sharma, Mohit, et al. ECS Journal of Solid State Science and Technology 11.6 (2022): 064004.
9. “Evolution of interfacial voids in Cu-to-Cu joints.” Liu, Hung-Che, et al. Materials Characterization (2022): 112085.
10. “Failures of Cu-Cu Joints under Temperature Cycling Tests.” Hsu, Po-Ning, et al. Materials 15.14 (2022): 4944.
11. “Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints.” Ong, Jia-Juen, et al. Scientific Reports 12.1 (2022): 1-10.
12. “Distribution of elastic stress as a function of temperature in a 2-μm redistribution line of Cu measured with X-ray nanodiffraction analysis.” Hsu, Wei-You, et al. Journal of Materials Research and Technology 20 (2022): 2799-2808.
13. “Single-crystal-like Cu joints with high strength and resistance to fatigue failures.” Ong, Jia-Juen, et al. Materials Science and Engineering: A 857 (2022)
14. “Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints.” Hsu, Po-Ning, et al. Materials 15.20 (2022): 7115.
15. “Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography.” Tran, Dinh-Phuc, et al. Materials Characterization 194 (2022): 112404.
16. “Surface protrusion induced by inter-diffusion on Cu-Sn micro-pillars.” Chen, Yang, et al. Materials & Design (2022): 111318.

▲Back to top▲

► 2021~ (16)

1. “A kinetic model of copper-to-copper direct bonding under thermal compression.” Shie, Kai-Cheng, et al. Journal of Materials Research and Technology 15 (2021): 2332-2344.
2. “Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps.” Shie, Kai-Cheng, et al. Materials 14.21 (2021): 6394.
3. “Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling.” Shie, Kai-Cheng, et al. Materials 14.19 (2021): 5522.
4. “Interfacial void ripening in CuCu joints.” Liu, Hung-Che, et al. Materials Characterization 181 (2021): 111459.
5. “Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating.” Hung, Yu-Wen, et al. Nanomaterials 11.8 (2021): 2135.
6. “Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM.” Shen, Fang-Chun, et al. Acta Materialia (2021): 117250.
7. “Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2. 3Ag Microbumps with Different UBM Structures under Thermal Cycling.” Mo, Chun-Chieh, et al. Metals 11.7 (2021): 1065.
8. “A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu.” Juang, Jing-Ye, et al. Journal of Materials Research and Technology 14 (2021): 719-730.
9. “Low Resistance and High Electromigration Lifetime of Cu-To-Cu Joints Using (111)-Oriented Nanotwinned Copper.” Juang, Jing-Ye, et al. Adv. Mater. Lett (2021), 12(8), 21081654.
10. “Electrodeposition of Slanted Nanotwinned Cu Foils with High Strength and Ductility.” Tran, Dinh-Phuc, et al. Electrochimica Acta (2021): 138640.
11. “Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films.” Tseng, I-Hsin, et al. Acta Materialia (2021): 116637.
12. “Effect of anisotropic grain growth on improving the bonding strength of< 111>-oriented nanotwinned copper films.” Chang, Shih-Yang, et al. Materials Science and Engineering: A 804 (2021): 140754.
13. “Effect of Deposition Temperature on Mechanical Properties of Nanotwinned Cu Fabricated by Rotary Electroplating.” Cheng, Hsiang-Yuan, et al. Materials Science and Engineering: A (2021): 141065.
14.  “Electromigration failure mechanisms of< 111>-oriented Nanotwinned Cu Redistribution Lines with Polyimide Capping.” Tseng, I-Hsin, et al. Results in Physics (2021): 104154.
15. “Effect of oxidation on electromigration in 2-µm Cu redistribution lines capped with polyimide.” Tseng, I-Hsin, et al. Results in Physics 31 (2021): 105048.
16. “Modeling of abnormal grain growth in (111) oriented and nanotwinned copper.” Gusak, A. M., et al. Scientific Reports 11.1 (2021): 1-11.

▲Back to top▲

► 2020~ (12)

1. 1. “Fabrication and characteristics of highly ⟨ 110⟩-oriented nanotwinned Au films.” Chiu, Wei-Lan, et al. Scientific reports 10.1 (2020): 1-10.
   2. “Deformation induced columnar grain rotation in nanotwinned metals.” Li, Yu-Jin, et al. Materials Science and Engineering: A 797 (2020): 140045.
   3. “Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films.” Tseng, Chih-Han, et al. Materials Characterization 168 (2020): 110545.
   4. “Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper.” Wu, Yu-Ting, and Chih Chen. Journal of Electronic Materials 49.1 (2020): 13-17.
   5. “Ultra-high annealing twin density in< 211>-oriented Cu films.” Chen, Kuan-Ju, et al. Scripta Materialia 184 (2020): 46-51.
   6. “Effect of reverse currents during electroplating on the< 111>-oriented and nanotwinned columnar grain growth of copper films.” Chen, Kuan-Ju, John A. Wu, and Chih Chen. Crystal Growth & Design (2020).
   7. “Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints.” Gusak, A. M., K. N. Tu, and Chih Chen. Scripta Materialia 179 (2020): 45-48.
   8. “Fabrication and Characterization of⟨ 100⟩-Oriented Quasi-single Crystalline Cu Lines.” Lu, Tien-Lin, John A. Wu, and Chih Chen. Crystal Growth & Design 20.3 (2020): 1485-1490.
   9. “Tensile properties of< 111>-Oriented nanotwinned Cu with different columnar grain structures.” Li, Yu-Jin, King-Ning Tu, and Chih Chen. Materials 13.6 (2020): 1310.
   10. “Tensile properties and thermal stability of unidirectionally< 111>-oriented nanotwinned and< 110>-oriented microtwinned copper.” Li, Yu-Jin, King-Ning Tu, and Chih Chen. Materials 13.5 (2020): 1211.
   11. “Anisotropic grain growth in (111) nanotwinned cu films by DC electrodeposition.” Lu, Tien-Lin, et al. Materials 13.1 (2020): 134.
   12. “Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure.” Wang, I-Ju, et al. Journal of Electronic Materials 49.1 (2020): 109-115.

▲Back to top▲

► 2019~ (2)

1. 1. “Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2. 3Ag-Ni microbumps.” Shen, Yu-An, Fan-Yi Ouyang, and Chih Chen. Materials Letters 236 (2019): 190-193.
   2. “Instant Cu-to-Cu direct bonding enabled by< 111>-oriented nanotwinned Cu bumps.” Shie, Kai Cheng, Jing-Ye Juang, and Chih Chen. Japanese Journal of Applied Physics 59.SB (2019): SBBA03.

▲Back to top▲

► 2018~ (8)

1. 1. “Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding.” Tseng, Chih-Han, King-Ning Tu, and Chih Chen. Scientific reports 8.1 (2018): 1-7.
   2. “Growth Mechanism of Self-Assembled TixWyO Nanotubes Fabricated by TiW Alloy Anodization.” Chang, Yung-Huang, et al. Journal of The Electrochemical Society 165.10 (2018): D477.
   3. “A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.” Chang, Yuan-Wei, et al. Scientific reports 8.1 (2018): 1-10.
   4. “Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient.” Juang, Jing-Ye, et al. Scientific reports 8.1 (2018): 1-11.
   5. “Fabrication of (111)-oriented nanotwinned Au films for Au-to-Au direct bonding.” Wu, John A., et al. Materials 11.11 (2018): 2287.
   6. “Growth of Highly (111)-Oriented Nanotwinned Cu with the Addition of Sulfuric Acid in CuSO4 Based Electrolyte.” Tseng, Chih-Han, and Chih Chen. Crystal Growth & Design 19.1 (2018): 81-89.
   7. “Anisotropic grain growth to eliminate bonding interfaces in direct copper-to-copper joints using< 111>-oriented nanotwinned copper films.” Chu, Yi-Cheng, and Chih Chen. Thin Solid Films 667 (2018): 55-58.
   8. “Correlation between the microstructures of bonding interfaces and the shear strength of Cu-to-Cu joints using (111)-oriented and nanotwinned Cu.” Juang, Jing-Ye, et al. Materials 11.12 (2018): 2368.

▲Back to top▲

► 2017~ (6)

1. 1. “Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration.” YA Shen, Chih Chen, Scripta Materialia 128, 6-9 (2017).
   2. “Effect of Sn Grain Orientation on Formation of Cu 6 Sn 5 Intermetallic Compound Under Current Stressing.” Chen, Ming-Yao, Han-wen Lin, and Chih Chen. Journal of Electronic Materials 46.4 (2017): 2179-2184.
   3. “Communication—Growth of< 111> nanotwinned nickel films on< 111> nanotwinned Cu substrates.” Chu, Yi-Cheng, and Chih Chen. ECS Journal of Solid State Science and Technology 6.10 (2017): P715.
   4. “Growth competition between layer-type and porous-type Cu3Sn in microbumps.” Chu, David T., et al. Microelectronics Reliability 79 (2017): 32-37.
   5. “Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests.” Chu, Yi-Cheng, et al. Electronic Materials Letters 13.6 (2017): 457-462.
   6. “Electromigration mechanism of failure in flip-chip solder joints based on discrete void formation.” Chang, Yuan-Wei, et al. Scientific reports 7.1 (2017): 1-16.

▲Back to top▲

► 2016 (8)

1. 1. “Study of discrete voids formation in flip-chip solder joints due to electromigration using in-situ 3D laminography and finite-element modeling”, Yuan-Wei Chang, Y Cheng, F Xu, L Helfen, T Tian, MD Michiel, Chih Chen, King-Ning Tu, T Baumbach, Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. IEEE, 2016.
   2. “Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling”, Yuan-Wei Chang, Y Cheng, F Xu, L Helfen, T Tian, MD Michiel, Chih Chen, King-Ning Tu, T Baumbach, Acta Materialia 117 (2016): 100-110.
   3. “Electromigration in microbumps with Cu-Sn intermetallic compounds”, YC Chu, CJ Zhan, HW Lin, YW Huang, Chih Chen, Electronics Packaging (ICEP), 2016 International Conference on, 252-255 (2016).
   4. “Electromigration in reduced-height solder joints with Cu pillars”, MY Chen, YC Liang, Chih Chen, Journal of Materials Science: Materials in Electronics 27 (4), 3715-3722 (2016).
   5. “Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures”, WL Chiu, CM Liu, YS Haung, Chih Chen, Materials Letters 164, 5-8 (2016).
   6. “Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu”, Chih Chen, CM Liu, HW Lin, YS Huang, YC Chu, DR Lyu, KN Chen, King-Ning Tu, 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5 (2016).
   7. “Formation mechanism of porous Cu3Sn intermetallic compounds by high current stressing at high temperatures in low-bump-height solder joints”, JA Lin, CK Lin, CM Liu, YS Huang, Chih Chen, DT Chu, King-Ning Tu, Crystals 6.1 (2016): 12.
   8. “Communication—Formation of Porous Cu3Sn by High-Temperature Current Stressing”, CK Lin, Chih Chen, DT Chu, King-Ning Tu, ECS Journal of Solid State Science and Technology 5 (9), P461-P463 (2016).

▲Back to top▲

► 2015 (6)

1. 1. “Bump resistance change behavior due to Cu-Sn IMCs formation with various solder diameters”, WL Hsieh, CK Lin, CJ Zhan, YW Huang, Chih Chen, Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the. IEEE, 2015.
   2. “Electromigration immortality of purely intermetallic micro-bump for 3D integration”,HY Chen, CH Tung, YL Hsiao, JL Wu, TC Yeh, LLC Lin, Chih Chen, DCH Yu, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 620-625 (2015).
   3. “Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging”, WL Chiu, CL Lu, HS Lin, CM Liu, YS Huang, TL Lu, TC Liu, HY Hsiao, Chih Chen, JC Kuo, King-Ning Tu, Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. IEEE, 2015.
   4. “Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces”, CH Tseng, CM Liu, HW Lin, YC Chu, Chih Chen, DR Lyu, KN Chen, King-Ning Tu, Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. IEEE, 2015.
   5. “Vertical interconnects of microbumps in 3D integration”, ,Chih Chen, D Yu, KN Chen, MRS Bulletin 40 (03), 257-263 (2015).
   6. “Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu”, CM Liu, HW Lin, YS Huang, YC Chu, Chih Chen, DR Lyu, KN Chen, King-Ning Tu, Scientific reports 5 (2015): 9734.

▲Back to top▲

► 2014 (11)

1. 1. “Fast phase transformation due to electromigration of 18 μm microbumps in three-dimensional integrated-circuit integration”, Yuan-Wei Chang, Chih Chen, TC Chang, CJ Zhan, JY Juang, AT Huang, Materials Letters 137, 136-138 (2014).
   2. “Failure mechanism of Cu/SnAg/Ni microbumps in three-dimensional integral circuits under electromigration”, WH Lin, SH Chao, CJ Zhan, YW Huang, Chih Chen, Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International. IEEE, 2014.
   3. “Grain growth in electroplated (111)-oriented nanotwinned Cu”, YS Huang, CM Liu, WL Chiu, Chih Chen, Scripta Materialia 89, 5-8 (2014).
   4. “Extremely anisotropic single-crystal growth in nanotwinned copper”, CL Lu, HW Lin, CM Liu, YS Huang, TL Lu, TC Liu, HY Hsiao, Chih Chen, JC Kuo, King-Ning Tu, NPG Asia Materials 6.10 (2014): e135.
   5. “Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu”, CM Liu, HW Lin, CL Lu, Chih Chen, Scientific reports 4 (2014): 6123.
   6. “Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing”, CK Lin, CM Liu, Chih Chen, Materials Letters 124, 261-263 (2014).
   7. “Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces”, CM Liu, HW Lin, YC Chu, Chih Chen, DR Lyu, KN Chen, King-Ning Tu, Scripta Materialia 78, 65-68 (2014).
   8. “Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60 цm-pitch solder micro bump interconnections”, YW Huang, CJ Zhan, JY Juang, YM Lin, SY Huang, SM Chen, CW Fan, RS Cheng, SH Chao, WL Hsieh, Chih Chen, JH Lau, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1908-1914 (2014).
   9. “Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization”, WL Chiu, CM Liu, YS Haung, Chih Chen, Applied Physics Letters 104 (17), 171902 (2014).
   10. “Effects of bump height and UBM structure on the reliability performance of 60 µm-pitch solder micro bump interconections”, YW Huang, CJ Zhan, YM Lin, JY Juang, SY Huang, SM Chen, CW Fan, RS Cheng, SH Chao, CK Lin, JA Lin, Chih Chen, Electronics Packaging (ICEP), 2014 International Conference on, 612-617 (2014).
   11. “Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints”, CK Lin, Yuan-Wei Chang, Chih Chen, J. of Appl. Phys., 115 (8), 083707 (2014).

▲Back to top▲

► 2013 (8)

1. 1. “Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis”, CK Lin, WA Tsao, YC Liang, Chih Chen, J. Appl. Phys., 114, 113711-1-113711-7 (2013).
   2. “Microstructure control of uni-directional growth of η-Cu6Sn5 in microbumps on <111> oriented and nanotwinned Cu”, HW Lin, JL Lu, CM Liu, Chih Chen, D Chen, JC Kuo, King-Ning Tu, Acta Materialia, 61, 4910–4919 (2013).
   3. “Effect of Geometric Nanostructures on the Absorption Edges of 1-D and 2-D TiO2 Fabricated by Atomic Layer Deposition”, YH Chang, CM Liu, HE Cheng, Chih Chen, ACS Appl. Mater. Interfaces, 5, 3549−3555 (2013).
   4. “Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints”, YC Liang, HW Lin, HP Chen, Chih Chen, King-Ning Tu, YS Lai, Scripta Materialia, 69, 25–28 (2013).
   5. “Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy”, King-Ning Tu, HY Hsiao, Chih Chen, Microelectronics Reliability, 53, 2–6 (2013).
   6. “Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps”, Yuan-Wei Chang, HY Peng, RW Yang, Chih Chen, TC Chang, CJ Zhan, JY Juang, AT Huang, Microelectronics Reliability, 53, 41–46 (2013).
   7. “Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging”, TC Liu, YS Huang, Chih Chen, ECS Solid State Letters, 2(2) P15-P18 (2013).
   8. “Eliminate Kirkendall voids in solder reactions on nanotwinned copper”, TC Liu, CM Liu, YS Huang, Chih Chen, King-Ning Tu, Scripta Materials, 18, 241-244 (2013).

▲Back to top▲

► 2012 (20)

1. 1. “Thermomigration in solder joints”, Chih Chen, HY Hsiao, Yuan-Wei Chang, F Ouyang, King-Ning Tu, Materials Science and Engineering R, 73, 85-100 (2012).
   2. “Fabrication and characterization of (111)-oriented and nanotwinned Cu by DC electrodeposition”, TC Liu, CM Liu, HY Hsiao, JL Lu, YS Huang, Chih Chen, Crystal Growth and Design, 12(10), 5012-5016 (2012).
   3. “Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam”, TC Liu, Chih Chen, KJ Chiu, HW Lin, JC Kuo, Materials Characterization, 74, 42–48 (2012).
   4. “Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow”, YC Liang, Chih Chen, King-Ning Tu, ECS Solid State Lett, 1, 60-62 (2012).
   5. “Growth Mechanism of Self-Assembled TiO2 Nanorod Arrays on Si Substrates Fabricated by Ti Anodization”, YH Chang, HW Lin, Chih Chen, J. Electrochem. Soc, 159(9), D512-D517 (2012).
   6. “The Effect of Geometric Structure on Photoluminescence Characteristics of 1-D TiO2 Nanotubes and 2-D TiO2 Films Fabricated by Atomic Layer Deposition”, YH Chang, CM Liu, Chih Chen, HE Cheng, J. Electrochem. Soc., 159(7), D401-D405 (2012).
   7. “Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish”, MH Chu, SW Liang, Chih Chen, AT Huang, J. Elec. Mat., 41(9), 2502 (2012).
   8. “Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints”, MY Guo, CK Lin, Chih Chen, King-Ning Tu, Intermetallics, 29, 155 (2012).
   9. “Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper”, HY Hsiao, CM Liu, HW Lin, TC Liu, CL Lu, YS Huang, Chih Chen, King-Ning Tu, Science, 336, 1007 (2012).
   10. “The Differences in Optical Characteristics of TiO2 and TiO2/AAO Nanotube Arrays Fabricated by Atomic Layer Deposition”, YH Chang, CM Liu, Chih Chen, HE Cheng, TC Lu, J. Electrochemical Society, 159(5), K136 (2012).
   11. “Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints”, HY Chen, MF Ku, Chih Chen, Advances in Materials Research, 1(1), 83 (2012).
   12. “The heterojunction effects of TiO2 nanotubes fabricated by atomic layer deposition on photocarrier transportation direction”, YH Chang, CM Liu, Chih Chen, HE Cheng, Nanoscale Research Lett., 7, 231 (2012).
   13. “Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging”, RW Yang, Yuan Wei Chang, WC Sung, Chih Chen, Materials Chemistry and Physics, 134, 340– 344 (2012).
   14. “Kinetic study of the intermetallic compound formation between eutectic Sn–3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints”, HY Chen, Chih Chen, J. Mat. Res., 27(8), (2012).
   15. “The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering”, YS Huang, HY Hsiao, Chih Chen, King-Ning Tu, Scripta Materialia, 66, 741 (2012).
   16. “Thermomigration of Ti in flip-chip solder joints”, HY Chen, HW Lin, CM Liu, Yuan-Wei Chang, AT Huang, Chih Chen, Scripta Materialia, 66, 694 (2012).
   17. “Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints”, YC Liang, WA Tsao, Chih Chen, DJ Yao, AT Huang, YS Lai, J. Appl. Phys. 111, 043705 (2012).
   18. “Core-Shell Ni-NiO Nano Arrays for UV Photodetection without an External Bias”, CM Liu, Chih Chen, YC Tseng, J. Electrochemical Society, 159(4), K78 (2012).
   19. “Facile Fabrication of TiO2 Nanorod Arrays for Gas Sensing using Double-Layered Anodic Oxidation Method”, HW Lin, YH Chang, Chih Chen, J. Electrochemical Society, 159(1), K5 (2012).

▲Back to top▲

► 2011 (9)

1. 1. “Coupled microstructural and magnetic transition in Co-doped Ni nano-arrays”, CY Yang, CC Huang, YC Tseng, CM Liu, Chih Chen, HJ Lin, J. Appl. Phys., 110, 073913 (2011).
   2. “Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu”, HY Hsiao, CC Hu, MY Guo, Chih Chen, King-Ning Tu, Scripta Materialia, 65, 907 (2011).
   3. “Innovative methodologies of circuit edit by focused ion beam (FIB) on wafer-level chip-scale-package (WLCSP) devices”, TC Liu, Chih Chen, ST Liu, ML Chang, JJ Lin, J. Mat. Sci: Mat. Elec. 22, 1536 (2011).
   4. “Magnetic properties of electroless-deposited Ni and Ni-NiO core-shell nano-arrays”, CC Lo, CC Huang, CM Liu, Chih Chen, CY Kuo, HJ Lin, YC Tseng, J. Magnetism and Magnetic Mat., 323(15), 1950 (2011).
   5. “Magnetostructural phase transition in electroless-plated Ni nanoarrays”, CC Huang, CC Lo, YC Tseng, CM Liu, Chih Chen, J. Appl. Phys., 109, 113905 (2011).
   6. “Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints”, HY Chen, Chih Chen, J. Mater. Res., 26(8), 983 (2011).
   7. “Ultraviolet Photoresponse of TiO2 Nanotube Arrays Fabricated by Atomic Layer Deposition”, CM Liu, Chih Chen, HE Cheng, Electrochemical and Solid-State Lett, 14(6), K33 (2011).
   8. “Effect of Si-die dimensions on electromigration failure time of flip-chip solder joints”, Yuan-Wei Chang, SH Chiu, Chih Chen, DJ Yao, Mat. Chem. and Phys.. 127, 85 (2011).
   9. “Growth Mechanism of TiO2 Nanotube Arrays in Nanopores of Anodic Aluminum Oxide on Si Substrates by Atomic Layer Deposition”, CM Liu, Chih Chen, HE Cheng, J. Electrochemical Society, 158(3), K58 (2011)
   10. “Ultrafast Initial Growth Rate of Self-Assembled TiO2 Nanorod, Arrays Fabricated by Ti Anodization”, YH Chang, HW Lin, Chih Chen, Electrochemical and Solid-State Lett., 14(1) K1 (2011).

▲Back to top▲

► 2010 (7)

1. 1. “Fabrication and Characteristics of Self-Aligned ZnO Nanotube and Nanorod Arrays on Si Substrates by Atomic Layer Deposition”, YH Chang, SM Wang, CM Liu, Chih Chen, J. Elec. Society, 157(11), K236 (2010).
   2. “Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints”, Yuan-Wei Chang, SH Chiu, Chih Chen, J. Elec. Mat. 39(11), 2489 (2010).
   3. “Effect of Al-trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints”SW Liang, HY Hsiao, Chih Chen, J. Elec. Mat., 39(10), 2316 (2010).
   4. “Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump-metallization”, HY Chen, Chih Chen, J. Mater. Res., 25(9), 1847(2010).
   5. “Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints”, Chih Chen, HM Tong, King-Ning Tu, Annual Reviews Materials Research, 40, 531 (2010).
   6. “Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration”, SW Liang, Chih Chen, JK Han, L Xu, King-Ning Tu, YS Lai, J. Appl. Phys., 107, 093715 (2010).
   7. “Direct probe of heterojunction effects upon photoconductive properties of TiO2 nanotubes fabricated by atomic layer deposition”, YH Chang, CM Liu, YC Tseng, Chih Chen, CC Chen, HE Cheng, Nanotechnology 21, 225602 (2010).

▲Back to top▲

► 2009 (9)

1. 1. “Gate-to-drain capacitance verifying the continuous-wave green laser crystallization n-TFT trapped charges distribution under dc voltage stress”, ZY Hsieh, MC Wang, SY Chen, Chih Chen, HS Huang, Appl. Phys. Lett. 95, 253503 (2009).
   2. “Non-uniform and negative marker displacements induced by current crowding during electromigration in flip chip Sn-0.7Cu solder joints”, SW Liang, HY Hsiao, Chih Chen, L Xu, King-Ning Tu, YS Lai, J. Elec. Mat., 38(12), 2443 (2009).
   3. “Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition”, CM Liu, YC Tseng, Chih Chen, MC Hsu, TY Chao, YT Cheng, Nanotechnology, 20, 415703 (2009).
   4. “Trend Transformation of Drain-current Degradation under Drain-avalanche Hot-carrier Stress for CLC n-TFTs”, ZY Hsieh , MC Wang, Chih Chen, JM Shieh, YT Lin, SY Chen, HS Huang, Microelectronics Reliability (2009).
   5. “Effect of bump size on current density and temperature distributions in flip-chip solder joints”, WC Kuan, SW Liang, Chih Chen, Microelectronics Reliability, 49, 544 (2009).
   6. “The Inductance Enhancement Study of Spiral Inductor Using Ni–AAO Nanocomposite Core”, MC Hsu, TY Chao, YT Cheng, CM Liu, Chih Chen, IEEE Trans. on Nanotechnology. 8, 3 (2009).
   7. “Thermomigration in Pb-free SnAg solder joint under alternating current stressing”, HY Hsiao, Chih Chen, Appl. Phys. Lett. 94, 092107, (2009).
   8. “Interfacial reaction between eutectic SnPb solder and electroplated-Ni as well as electroless-Ni metallization during reflow”, HY Chen, Chih Chen, J. Elec. Mat., 38(2), 338 (2009).
   9. “Electromigration in Sn-Cu intermetallic compounds”, CC Wei, CF Chen, PC Liu, Chih Chen, J. Appl Phys, 105, 023715 (2009).

▲Back to top▲

► 2008 (7)

1. 1. “Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints”, HY Chen, Chih Chen, King-Ning Tu, Appl. Phys. Lett. 93, 122103 (2008).
   2. “Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy”, HY Hsiao, SW Liang, MF Ku, Chih Chen, DJ Yao, J. Appl. Phys., 104, 033708, (2008).
   3. “Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes”, CC Wei, PC Liu, Chih Chen, King-Ning Tu, Journal of Materials Research, 23, 2017 (2008).
   4. “Magnetic bead-based DNA detection with multi-layers quantum dots labeling for rapid detection of Escherichia coli O157:H7”, YJ Liu, DJ Yao, HY Chang, CM Liu, Chih Chen, Biosensors and Bioelectronics, 24, 558 (2008).
   5. “Effect of pre-aging on electromigration of flip-chip SnAg solder joints”, PC Yang, CC Kuo, Chih Chen, JOM., 60(6), 77 (2008).
   6. “Effect of Migration and Condensation of Pre-existing Voids on Bump Resistance Increase in Flip-Chip on Flexible Substrate during Electromigration”, SW Liang, Yuan-Wei Chang, Chih Chen, J Preciado, and King-Ning Tu, J. Elec. Mater., 37(7), 962 (2008).
   7. “Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder”, HY Chen, Chih Chen, PW Wu, JM Shieh, SS Cheng, K Hensen, J. Elec. Mater., 37(2), 224 (2008).
   8. “Enhanced green laser-activation by anti-reflective gate structuresin panel transistors”, JM Shieh, Chih Chen, YT Lin, CL Pan, Appl. Phys. Lett., 92, 063503 (2008).

▲Back to top▲

► 2007 (14)

1. 1. “Fabrication of Anodic Aluminum Oxide Film on Large-Area Glass Substrate”CJ Yang, SW Liang, PW Wu, Chih Chen, JM Shieh, , Electrochemical and Solid-State Lett., 10(12), C69 (2007).
   2. “Relieving hot-spot temperature and current crowding effect during electromigration in solder bumps by using Cu columns”, SW Liang, Yuan-Wei Chang, Chih Chen, J. Elec. Mater., 36(10), 1348 (2007).
   3. “Effect of void propagation on bump resistance due to electromigration in flip-chip solder joints using Kelvin structure”, Yuan-Wei Chang, TH Chiang, Chih Chen, Appl. Phys. Lett., 91, 132113 (2007).
   4. “Relieving Sn Whisker Growth Driven by Oxidation on Cu Leadframe by Annealing and Reflowing Treatments”, CC Wei, PC Liu, Chih Chen, JC Lee, IP Wang, J. Appl. Phys., 102, 043521 (2007).
   5. “Enhanced hole-mobility and reliability of panel epi-like silicon transistors using backside green laser-activation”, YT Lin, JM Shieh, Chih Chen, Elec. Device Lett., 28(9) 790 (2007).
   6. “Fabrication of Ordered Ta2O5 Nanodots Using Anodic Aluminum Oxide Template on Si Substrate”, CJ Yang, Chih Chen, PW Wu, JM Shieh, SM Wang, SW Liang, J. Mater. Res., 22 (4) 1064 (2007).
   7. “Thermomigration in flip-chip SnPb solder joints under alternating current stressing”, HY Hsiao, Chih Chen, Appl. Phys. Lett., 90, 152105 (2007).
   8. “Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization”, JW Nah, K Chen, King-Ning Tu, BR Su, Chih Chen, J. Mater. Res. 22(3), 763 (2007).
   9. “3-D Thermo-electrical Simulation in Flip-chip Solder Joints with Thick under Bump Metallizations during accelerated electromigration testing”, SW Liang, Yuan-Wei Chang, Chih Chen, J. Elec. Mat. 36(2), 159 (2007).
   10. “Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints”, SW Liang, SH Chiu, Chih Chen, Appl. Phys. Lett., 90, 082103 (2007).
   11. “Stability of continuous-wave laser-crystallized epilike silicon transistors”, YT Lin, Chih Chen, JM Shieh, CL Pan, Appl. Phys. Lett., 90, 073508 (2007).
   12. “Low-temperature growth of ZnO nanorods in anodic aluminum oxide on Si substrate by atomic layer deposition”, CJ Yang, SM Wang, SW Liang, YH Chang, Chih Chen, JM Shieh, Appl. Phys. Lett., 90, 033104 (2007).
   13. invited review, “Stress analysis of spontaneous Sn whisker growth”, King-Ning Tu, Chih Chen, AT Wu, J. Mater. Sci.: Materials in electronics. 18:269–281 (2007).
   14. Invited review, “Electromigration Issues in Lead-Free Solder Joints”, Chih Chen, SW Liang, J. Mater. Sci.: Materials in electronics.. 18:259–268 (2007).

▲Back to top▲

► 2006 (18)

1. 1. “Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using X-ray microscopy”, SH Chiu, Chih Chen, Appl. Phys. Lett., 89, 262106 (2006).
   2. “Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy Layer”, AT Huang, CK Chou, Chih Chen, IEEE Tran. on Adv. Packaging, 29 (4), 760 (2006).
   3. “Characterization and field-emission properties of carbon nanotube arrays in nanoporous alumina template and on blank Si substrate”, CJ Yang, Chih Chen, JM Shie, J. Appl. Phys., 100, 104302 (2006).
   4. “Effect of Al-trace dimension on electromigration failure time of flip-chip solder joints”, SH Chiu, DJ Yao, Chih Chen, J. Elec. Mat., 35(9), 1740 (2006).
   5. “Geometrical effect of bump resistance measurement by Kelvin structure”, SW Liang, Yuan-Wei Chang, Chih Chen, J. Elec. Mat., 35(8), 1647 (2006).
   6. “Electromigration in Eutectic SnPb Solder Stripes”, CK Chou, YC Hsu, Chih Chen, J. Elec. Mat. 35(8), 1655 (2006).
   7. “Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes”, Yuan-Wei Chang, SW Liang, Chih Chen, Appl. Phys. Lett., 89, 032103 (2006).
   8. “Effect of 3-dimensional Current and Temperature Distribution on Void Formation and Propagation in Flip-chip Solder Joints during Electromigration”, SW Liang, Yuan-Wei Chang, TL Shao, Chih Chen, King-Ning Tu, Appl. Phys. Lett., 89, 022117 (2006).
   9. “Trap-state Density in continuous-wave laser-crystallized single-grain-like silicon transistors”, YT Lin, Chih Chen, JM Shieh and YJ Lee, CW Cheng, JT Peng, CW Chao, Appl. Phys. Lett., 88, 233511 (2006).
   10. “Roles of Additives in Damascene Copper Electropolishing”, SH Liu, JM Shieh, Chih Chen, K Hensen, SS Cheng, J. Elec. Society, 153(6), C428 (2006).
   11. “Aging influences of PEG Suppressors of Cu Electrolytes on Gap-filling”, SH Liu, TC Li, Chih Chen, JM Shieh, BT Dai, KK Hensen, SS Cheng, Japn. J. Appl. Phys. 45(5A), 3976(2006).
   12. “Temperature and current-density distributions in flip-chip solder joints with Cu traces”, CY Hsu, DJ Yao, SW Liang, Chih Chen, EC Yeh, J. Elec. Mat., 35(5), 947 (2006).
   13. “Interfacial Reaction and Shear Strength of Pb-free SnAg2.5Cu0.8Sb0.5 and SnAg3.0Cu0.5Sb0.2 Solder Bumps on Au/Ni(P) Metallization”, YC Hsu, YM Huang, Chih Chen, Henry Wang, J. Alloy and Compound, 417, 180 (2006).
   14. “Critical Length of Eutectic SnPb Solder Stripe”, CC Wei, Chih Chen, Appl. Phys. Lett., 88, 182105 (2006).
   15. “Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration”, SW Liang, Yuan-Wei Chang, Chih Chen, Appl. Phys. Lett., 88, 172108 (2006).
   16. “Redistribution of Pb-rich Phase during Electromigration in Eutectic SnPb Solder Stripes”, CK Chou, CA Chen , SW Liang, Chih Chen, J. Appl. Phys. 99, 054502 (2006).
   17. “Relieving Current Crowding Effect in Flip-chip Solder Joints during Current Stressing”, SW Liang, TL Shao, Chih Chen, Everett CC Yeh, King-Ning Tu, J. Mater. Res. 21(1), 137 (2006).
   18. “Infrared Microscopy of Hot Spots Induced by Joule Heating in Flip-chip SnAg Solder Joints under Accelerated Electromigration”, SH Chiu, TL Shao, Chih Chen, DJ Yao, CY Hsu, Appl. Phys. Lett. 88, 022110 (2006).

▲Back to top▲

► 2005 (8)

1. 1. “Measurement of Electromigration Parameters of Lead-free SnAg3.5 Solder Using V-groove Lines”, YC Hsu, DS Chen, PC Liu, Chih Chen, J. Mater. Res., 20(10) 2831 (2005).
   2. “Metallurgical Reactions of Sn-3.5Ag Solder with Various Thicknesses of Ni/Cu/ Under Bump Metallization”, CP Huang, Chih Chen, CY Liu, SS Lin, KH Chen, J. Mater. Res., 20(10), 2772 (2005).
   3. “Microstructure Evolution during Electromigration in Eutectic SnPb Solder Bumps”, YH Chen, TL Shao, PC Liu, Chih Chen, T Chou, J. Mater. Res., 20(9), 2432 (2005).
   4. “3-D Simulation on Current Density Distribution in Flip Chip Solder Joint under Electrical Current Stressing”, TL Shao, SW Liang, TC Lin, Chih Chen, J. Appl. Phys., 98, 044509 (2005).
   5. “Electromigration in Pb-free SnAg3.8Cu0.7 Solder Stripes”, YC Hsu, CK Chou, PC Liu, Chih Chen, DJ Yao, T Chou, King-Ning Tu, J. Appl. Phys., 98, 033523 (2005).
   6. “Study of Electromigration in Thin Tin Film Using Edge Displacement Method”, HC Yu, SH Liu, Chih Chen, J. Appl. Phys., 98, 013540 (2005).
   7. “Threshold Current Density of Electromigration in Eutectic SnPb Solder”, YT Yeh, CK Chou, YC Hsu, Chih Chen, King-Ning Tu, Appl. Phys. Lett., 86, 203504 (2005).
   8. “Two-Additive Electrolytes for Superplanarizing Damascene Cu Metals”, SH Liu, JM Shieh, Chih Chen, BT Dai, SS Cheng, Elec. Solid-State Lett., 8(3) C47-C50 (2005).

▲Back to top▲

► 2004 (7)

1. 1. “Critical Length of Ag Nanowires for Hydrophobic Behavior”, YH Cheng, JL Lin, CK Chou, Chih Chen, SY Cheng, Chem. Phys. Lett., 397(1-3), 17-20 (2004).
   2. “Cross Interactions on Interfacial Reactions of Solder Bumps and Metallization Layers during Reflow”, TL Shao, TS Chen, YM Huang, Chih Chen, J. Mat. Research, 19(12), 3654 (2004).
   3. “Thermal Gradient in Solder Joints under Electrical Current Stressing”, TL Shao, SH Chiu, Chih Chen, DJ Yao, CY Hsu, J. Elec. Mat., 33(11), 1350 (2004).
   4. “Electromigration Failure Mechanisms for SnAg3.5 Solder Bumps on Ti/Cr-Cu/Cu and Ni(P)/Au Metallization Pads”, TL Shao, YH Chen, SH Chiu, Chih Chen, J. Appl. Phys., 96(8), 4518 (2004).
   5. “Microstructure Evolution during Electromigration in Eutectic SnPb Solder Bumps”, CM Lu, TL Shao, CJ Yang, Chih Chen, J. Mat. Research, 19(8), 2394 (2004).
   6. “Tin Whisker Growth Driven by Electrical Currents”, SH Liu, Chih Chen, PC Liu, T Chou, J. Appl. Phys., 95(12), 7742 (2004).
   7. “Electromigration at the High-Pb/Eutectic SnPb Solder Interface”, JL Lai, CH Lin, Chih Chen, J. Mat. Research, 19(2), 550 (2004).

▲Back to top▲

► 2003 (2)

1. 1. “Electromigration Studies of Sn95/Sb5 Flip Chip Solder Bumps”, TL Shao, KC Lin, Chih Chen, J. Elec. Mat., 32, 11, 1278 (2003).
   2. “Electromigration study in SnAg3.8Cu0.7 Solder Joints on Ti/Cr-Cu/Cu Under Bump Metallization”, YC Hsu, TL Shao, CJ Yang, Chih Chen, J. Elec. Mat., 32, 11, 1222 (2003).

▲Back to top▲

► 2002 (1)

1. 1. “Stress relaxation of a patterned microstructure on a diaphragm”, DW Zheng, XH Wang, K Shyu, Chih Chen, CT Chang, King-Ning Tu, AK Mal, YF Guo, J. Mater. Res., 1795, 17, 7 (2002).

▲Back to top▲

► 2001 (3)

1. 1. “Electromigration in Eutectic SnPb Solder Lines”, QT Huynh, CY Liu, Chih Chen, King-Ning Tu, J. Appl. Phys., 89, 4332 (2001).
   2. “Effective compliant substrate for low-dislocation relaxed SiGe growth”, YH Luo, JL Liu, G Jin, J Wan, and KL Wang, CD Moore, MS Goorsky, Chih Chen, King-Ning Tu, Appl. Phys. Lett. 78, 9, 1219 (2001).
   3. “Enhanced dopant activation and elimination of end-of-range defects in BF2-implanted silicon-on-insulator by high-density current”, HH Lin, SL Cheng, LJ Chen, Chih Chen, King-Ning Tu, Appl. Phys. Lett. 79, 3971 (2001).

▲Back to top▲

► ~2000 (12)

1. 1. “Effect of current crowding on contact failure in heavily doped n+/- and p+/- silicon-on-insulator”, JS Huang, Chih Chen, CC Yeh, King-Ning Tu, TL Shofner, JL Drown, RB Irwin, CB Vartuli, J. Mat. Research, 15, 2387 (2000).
   2. “Electromigration in Sn-Pb solder strips as a function of alloy Composition”, CY Liu, Chih Chen, King-Ning Tu, J. Appl. Phys, 88, 5703 (2000).
   3. “Effect of current crowding on vacancy diffusion and void formation in electromigration”, King-Ning Tu, CC Yeh, CY Liu, Chih Chen, Appl. Phys. Lett., 76, 988 (2000).
   4. “Low-dislocation relaxed SiGe grown on an effective compliant substrate”, YH Luo, JL Liu, G Jin, KL Wang, CD Moore, Goorsky, Chih Chen, King-Ning Tu, J. Elec. Mat., 29, 950 (2000).
   5. “Twist-type Si Bicrystals and Compliant Substrates Prepared from Silicon-On-Insulator Wafers”, Chih Chen, King-Ning Tu, CH Tung, TT Sheng, A Ploessl, R Scholz, U Gösele, Phil. Mag., 80, 881 (2000).
   6. “Asymmetrical Heating Behavior of Doped Si Channels in Bulk Silicon and in Silicon-On-Insulator under High Current Stress”, CN Liao, Chih Chen, JS Huang, King-Ning Tu, J. Appl. Phys. 86, 6895 (1999).
   7. “Thermoelectric Characterization of Si Thin Films in SOI Wafers”, CN Liao, Chih Chen, King-Ning Tu., J. Appl. Phys., 86, 3204 (1999).
   8. “Two- and Three-dimensional arrays of magmnetic microspheres”, W Wen, DW Zheng, Chih Chen, King-Ning Tu, J. Mater. Res., 14, 4 (1999).
   9. “Direct Correlation Between Mechanical Failure and Metallurgical Reaction in Flip Chip Solder Joints”, CY Liu, Chih Chen, King-Ning Tu, J. Appl. Phys., 85, 3882 (1999).
   10. “Dopant Activation of Heavily-doped Silicon-On-Insulator by High Density Currents”, Chih Chen, JS Huang, CN Liao, King-Ning Tu, J. Appl. Phys., 86, 1552 (1999).
   11. “Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes”, CY Liu, Chih Chen, CN Liao, King-Ning Tu, Appl. Phys. Lett., 75, 58 (1999).
   12. “The Preparation of Twist-type Bicrystals of Silicon”, Chih Chen, G.Z. Pan, K.N. Tu, Materials Chemistry and Physics, 47, 90 (1997).

▲Back to top▲

► Patent (18)

1. 1. Chih Chen, Wei-Lan Chiu, Jia-Ling Lu. Circuit Structure And Method Of Fabricating The Same: Taiwan NO. 201719836. 2017-06-01.
   2. Chih Chen, Chia-Ling Lu. Copper Film With Large Grains, Copper Clad Laminate Having The Same And Manufacturing Method Thereof Of Copper Foils: Taiwan NO. 201621091. 2016-06-16.
   3. Chih Chen, Wei-Lan Chiu, Yi-Chia Chou. Preferred Oriented Nano-twins Au Film, Method Of Preparing The Same, And Connecting Structure Comprising The Same: Taiwan NO. 201606144. 2016-02-16.
   4. Chih Chen, Wei-Lan Chiu. Preferred Oriented Au Film, Method For Preparing The Same And Connecting Structure Comprising The Same: Taiwan NO. 201604293. 2016-02-01.
   5. Chih Chen, Yi Cheng Chu. Nano-twinned Ni Layer, Method For Manufacturing The Same, And Electrical Connecting Structure, Substrate And Package Structure Containing The Same: Taiwan NO. 201542888. 2015-11-16.
   6. Chih Chen, King-Ning Tu, Chia-Ling Lu. CU SINGLE CRYSTAL, Manufacturing Method Thereof And Substrate Comprising The Same: Taiwan NO. 201508099. 2015-03-01.
   7. Chih Chen, Tao-Chi Liu, Yi-Sa Huang, Chien-Min Liu. Electrical Connecting Element And Method For Manufacturing The Same: Taiwan NO. 201432828. 2014-08-16.
   8. Chih Chen, Hsing-Yao Hsiao. Circuit Board With Twinned Cu Circuit Layer And Method For Manufacturing The Same: Taiwan NO. 201417647. 2014-05-01.
   9. Chih Chen, Tao-Chi Liu, Wei-Lan Chiu. Electrical Connecting Element, Method Of Fabricating The Same, And Electrical Structure Comprising The Same: Taiwan NO. 201415563. 2014-04-16.
   10. Chih Chen, Han-Wen Lin. Electric Connecting Structure Comprising Preferred Oriented Cu6Sn5 Grains And Method Of Fabricating The Same: Taiwan NO. 201347111. 2013-11-16.
   11. Chih Chen, King-Ning Tu, Tao-Chi Liu. Electrodeposited Nano-twins Copper Layer And Method Of Fabricating The Same: Taiwan NO. 201321557. 2013-06-01.
   12. Chih Chen, King-Ning Tu, Hsing-Yao Hsiao. Method For Inhibiting Growth Of Intermetallic Compounds: Taiwan NO. 201308451. 2013-02-16.
   13. Chih Chen, Chien-Min Liu, Yuan-Chien Tseng. Photo Sensor And Method Of Fabricating The Same: Taiwan NO. 201304173. 2013-01-16.
   14. Chih Chen, King-Ning Tu. Sample Box For Electron Microscope: Taiwan NO. 201303951. 2013-01-16.
   15. Chih Chen, King-Ning Tu. Sample Box For Electron Microscope: Taiwan NO. 201303279. 2013-01-16.
   16. Chih Chen, Yuan-Wei Chang. Structure For Measuring Bump Resistance And Package Substrate Comprising The Same: Taiwan NO. 201243348. 2012-11-01.
   17. Chih Chen, Ching-Jung Yang, Shun-Mim Wang, Jia-Min Shien. Method Of Forming Nano-scale Material: Taiwan NO. 200930658. 2009-07-16.
   18. Chih Chen, Pu-Wei Wu, Chuen-Guang Chao, Ching-Jung Yang, Chien-Chon Chen, Shih-Wei Liang. Electrochemistry Mold: Taiwan NO. 200923136. 2009-06-01.