Full name
The Advanced Packaging and Metallization Lab
Principal
Prof. Chih Chen
Start from
2000 July
Address
605, Engineering VI, 1001 Ta Hsueh Road, Hsin-Chu, Taiwan 30010,ROC
TEL
(03) 571-2121 # 55377
Research
Our lab focuses on two main fields; Reliability tests on solder joints and microbumps, such as electromigration and thermomigration tests, and alternative interconnects in advanced packaging, namely research in direct bonding.
With the decrease in size of solder bumps, bump diameter and volume drastically decreases as well. Therefore, the importance of joint characteristic research and packaging technology application stands out as utmost importance.
We have conducted tests on IMC transformations under continuous annealing, successfully observing porous formation, confirming the damage potential of thermalmigration. To take packaging to a smaller, more efficient level, we conduct further researches on alternative methods of packaging.
A huge focus of our lab is the application of direct bonding. Not only can we successfully perform copper to copper direct bonding under low temperatures and low pressure, we can also fabricate different copper structures to fortify bonding formation results, strengthening bonding interface. Gold to gold direct bonding has also been researched. By altering its microstructure, we can apply a hard-gold surface onto different structures to strengthen interfaces.
Intensive research has been performed on nano-twinned copper (nt-Cu) in our lab. While maintaining the same conductivity as bulk copper, nt-Cu has higher thermal stability, mechanical strength and lower oxidation rate in comparison.
With superior properties, applications in direct bonding has been groundbreaking. The assistance of nt-Cu allows bonding at lower temperatures and pressure.With this research in nt-Cu, we apply this unique structure to InFo/Fan-out packaging technology. By electroplating nano-twinned structure into redistribution lines (RDLs), thermal cycle test have proven nt-Cu RDLs to be durable and reliable for industrial use.
Specialties
Close cooperation with Prof. King-Ning Tu in MSE, UCLA since 2003
Short-term exchanging scholar with Prof. King-Ning Tu since 2003
Champion of Packaging Softball Cup from 2002 to 2006